While soldering a BGA may look difficult, it is quite simple if the correct amount of solder paste is deposited. Too much solder paste and the balls will short out together when reflow. Not enough solder paste and you have a dry solder joint.

The alignment of the BGA device is also not so critical. The surface tension of the solder will "pull" the device into place when reflowing. The process is quite mechanical.

I wonder what the final cost of the whole thing is. Parts, board, etc...